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dc.contributorEconomy Divisionen_US
dc.contributor.authorParajuly, K.en_US
dc.contributor.authorKuehr, R.en_US
dc.contributor.authorAwasthi, A. K.en_US
dc.contributor.authorFitzpatrick, C.en_US
dc.contributor.authorLepawsky, J.en_US
dc.contributor.authorSmith E.en_US
dc.contributor.authorWidmer, R.en_US
dc.contributor.authorZeng, X.en_US
dc.coverage.spatialGlobalen_US
dc.date.accessioned2019-11-20T06:05:16Z
dc.date.available2019-11-20T06:05:16Z
dc.date.issued2019
dc.identifier.isbn978-92-808-9106-5en_US
dc.identifier.isbn978-92-808-9107-2en_US
dc.identifier.urihttp://hdl.handle.net/20.500.11822/30809
dc.descriptionUNU-Vie SCYCLE, StEP Initiative, and UNEP IETC have been working on E-Waste issues greatly and initiated an activity to assess the foresight challenges in the E-Waste stream to develop policy-level discussions on the challenges and opportunities ahead. Under the business-as-usual scenario, the amount of E-Waste will be more than doubled by 2050; “The complicated nature of production, use, and disposal of electronics require significant changes in order for the processes to become sustainable”. This paper maps several dimensions of the e-waste problem and provides a snapshot into future challenges. It looks into what we can anticipate into how the use of e-products and management of e-waste could evolve. The goal is to initiate public discussions on these unforeseen challenges and opportunities, in order for the political agendas of governments and businesses to address such issues early on.en_US
dc.formatTexten_US
dc.languageEnglishen_US
dc.publisherSolving the E-waste Problem (StEP) Initiative; United Nations University; United Nations Environment Programmeen_US
dc.rightsPublicen_US
dc.subjectELECTRONIC WASTEen_US
dc.subjectE-WASTEen_US
dc.subjectWASTE MANAGEMENTen_US
dc.subjectWASTEen_US
dc.titleFuture E-Waste Scenariosen_US
dc.typeReports and Booksen_US
wd.identifier.sdgSDG 3 - Good Health and Well-beingen_US
wd.tagsE-wasteen_US
wd.tagsWaste managementen_US
wd.topicsChemicals & wasteen_US
wd.identifier.pagesnumber34 p.en_US


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